发明名称 LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
摘要 Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
申请公布号 US2016204087(A1) 申请公布日期 2016.07.14
申请号 US201615075027 申请日期 2016.03.18
申请人 Bridgelux, Inc. 发明人 Zhang Wenhui;Tong Tao;Gan Zhengqing
分类号 H01L25/075;H01L33/60;H01L33/54;H01L33/62;H01L33/56;H01L33/58;H01L33/50 主分类号 H01L25/075
代理机构 代理人
主权项 1. A method for making a light emitting assembly comprising the steps of: arranging a plurality of Light Emitting Diode (LED) dies in a fixed location on an upper surface of a substrate, wherein the LED dies are electrically connected with one another; and forming optical lenses over each of the LED dies by covering the dies with a lens material and allowing the lens material to cure, wherein a mold is used to provide the cured lenses with a hemispherical shape having a diameter of from about 1.5 to 3 times the size of a respective die, and wherein the mold is removed from the substrate once the lens material has cured.
地址 Livermore CA US