发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
In a semiconductor device formed by mounting a chip laminate including a semiconductor chip having a small diameter and a semiconductor chip having a large diameter over the top surface of a substrate, an excessive stress is prevented from being added to a joint of the two semiconductor chips. By mounting a first semiconductor chip having a large diameter over a support substrate and thereafter mounting a second semiconductor chip having a small diameter over the first semiconductor chip, it is possible to: suppress the inclination and unsteadiness of the second semiconductor chip mounted over the first semiconductor chip; and hence inhibit an excessive stress from being added to a joint of the first semiconductor chip and the second semiconductor chip. |
申请公布号 |
US2016204082(A1) |
申请公布日期 |
2016.07.14 |
申请号 |
US201615075128 |
申请日期 |
2016.03.19 |
申请人 |
Renesas Electronics Corporation |
发明人 |
Sugiyama Michiaki;Kinoshita Nobuhiro |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |