| 摘要 |
Embodiments of the present invention generally include an apparatus for uniform heat distribution across the surface of a substrate during processing. The apparatus includes a substrate heater with a heated substrate support surface that is removable attached to a heater shaft via a fastening mechanism. The interface between the heated substrate support and the heater shaft may include a soft metal gasket and a vacuum or purge channel disposed therein. The substrate support surface may include regions for independently varying the back pressure of a substrate disposed thereon.
|
