A METHOD OF ASSEMBLING WAFERS BY MOLECULAR BONDING
摘要
The invention concerns a method of bonding two wafers (20, 30) by molecular bonding in which a first propagation of a bonding wave initiated from a point of pressure (43) applied to at least one (30) of the two wafers is followed by a second propagation of the bonding wave over a zone covering the point of pressure (43). The second bonding wave propagation may be obtained by interposing a separating element (41) between the two wafers and by withdrawing the element at least after the start of the first bonding wave propagation.
申请公布号
WO2009135800(A2)
申请公布日期
2009.11.12
申请号
WO2009EP55251
申请日期
2009.04.30
申请人
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES;BROEKAART, MARCEL;ASPAR, BERNARD;LAGAHE, CHRYSTELLE;BARGE, THIERRY