| 摘要 |
PROBLEM TO BE SOLVED: To provide a device packaging structure that packs a device with an excellent reliability, with a good yield, and without lowering workability in conducting electrical connection even when a connection terminal and a forming pitch of a connecting part become smaller. SOLUTION: A first conductive connection part 80 formed on a first face of a substrate and a connection terminal 200a of a device arranged on a second face which is arranged with a level difference from the first face are electrically connected. On the second face which is arranged on the same side as the first face, a second conductive connection part 34 which is connected to the conductive terminal is formed, and a process is included in which the first conductive connection part and the second conductive connection part are electrically connected via a connector 360 which includes a first terminal electrode 36b which at least has the height of the level difference and which is connected to the first conductive connection part; a second terminal electrode 36c which is connected to the second conductive connection part and provided facing the same side as the first terminal electrode; and a connecting wiring 36d which electrically connects between the first terminal electrode and the second terminal electrode. COPYRIGHT: (C)2010,JPO&INPIT |
