发明名称 INTEGRATED CIRCUIT WITH UNIFORM POLYSILICON PERIMETER DENSITY, METHOD AND DESIGN STRUCTURE
摘要 Disclosed are embodiments of forming an integrated circuit with a desired decoupling capacitance and with the uniform and targeted across-chip polysilicon perimeter density. The method includes laying out functional blocks to form the circuit according to the design and also laying out one or more decoupling capacitor blocks to achieve the desired decoupling capacitance. Then, local polysilicon perimeter densities of the blocks are determined and, as necessary, the decoupling capacitor blocks are reconfigured in order to adjust for differences in the local polysilicon perimeter densities. This reconfiguring is performed in a manner that essentially maintains the desired decoupling capacitance. Due to the across-chip polysilicon perimeter density uniformity, functional devices in different regions of the chip will exhibit limited performance parameter variations (e.g., limited threshold voltage variations). Also disclosed herein are embodiments of an integrated circuit structure formed according to the method embodiments and a design structure for the integrated circuit.
申请公布号 US2009278222(A1) 申请公布日期 2009.11.12
申请号 US20080117771 申请日期 2008.05.09
申请人 CHADWICK LAURA S;CULP JAMES A;HATHAWAY DAVID J;POLSON ANTHONY D 发明人 CHADWICK LAURA S.;CULP JAMES A.;HATHAWAY DAVID J.;POLSON ANTHONY D.
分类号 H01L27/00;G06F17/50 主分类号 H01L27/00
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