| 摘要 |
A process for fabricating a molding stamp mainly includes the steps of: forming a metal seed film on a substrate; forming a photo resist layer on the metal seed film; exposing the photo resist layer by a direct writing method, and developing the photo resist layer thereby forming a pattern of the photo resist layer, the pattern made of a number of microlens structures and a through hole configured for exposing a portion of the metal seed film therefrom; electroforming a body on the substrate to cover the pattern of the photo resist layer, the body having an extending portion being connected with the metal seed film via the through hole of the photo resist layer; removing the photo resist layer from the substrate; and separating the electroformed body from the substrate.
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