METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE

摘要

A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes form a structure of leads and a die pad on the electrically conductive layer. The plurality of holes are filled with a non-conductive material. Next; an electrically conductive foil is attached on the top surface of the electrically conductive layer and the non-conductive epoxy material. The, the electrically conductive foil is etched to create a network of leads, die pad, bus lines, dam bars and tie lines, wherein the bus lines connect the leads to the dam bar, the dam bar is connected to the tie line and the tie line is connected to the die pad.

主权项

1. A semiconductor package comprising:
an electrically conductive layer having a plurality of holes at a top surface, wherein said plurality of holes are filled with a non-conductive material; an electrically conductive foil on said top surface of said electrically conductive layer and said non-conductive material, wherein said electrically conductive foil creates a network of leads, die pad, bus lines, dam bars and tie lines, wherein said bus lines connect said leads to said dam bar, said dam bar is connected to said tie line and said tie line is connected to said die pad; and a semiconductor die attached to said die pad.