PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A wiring circuit board and a manufacturing method thereof are provided to improve connection between a conductive pattern and an electric component by reducing stress applied to a conductive pattern in the thermal expansion of a base insulation layer and a metal layer. CONSTITUTION: A wiring circuit board includes a base insulation layer(1), a conductive pattern(2), a cover insulation layer(4) and a metal layer(3). The conductive pattern is formed in one side of the base insulation layer. A terminal(21) of a conductive pattern is electrically connected to the electric component. A cover insulation layer is formed in one side of the base insulation layer to cover the conductive pattern. An opening of the cover insulation layer exposes the terminal of the conductive pattern. The metal layer is formed in the other side of the base insulation layer. The metal layer includes an opening facing region and a stress relaxation region. The opening facing region is overlapped with the opening of the cover insulation layer. The stress relaxation region is larger than the opening facing region.