| 摘要 |
<p>A process for producing a circuit board, in which an insulating layer and a metal film layer excelling in uniformity and adherence to the insulating layer can be efficiently formed. The process for producing a circuit board comprises the steps of laminating a substrate with an adhesive film with metal film composed of a support layer and, sequentially superimposed thereon, a water-soluble polymer release layer, a metal film layer and a hardening resin composition layer, the above water-soluble polymer release layer having such a detachability that it is detachable at the interface of the support layer and itself after the below-mentioned step of hardening of the hardening resin composition layer, so that the hardening resin composition layer is brought into contact with the substrate; hardening the hardening resin composition layer; detaching the support layer; and dissolving away with an aqueous solution the water-soluble polymer release layer being present on the metal film layer. By virtue of the constitution of this process, a metal film layer of high uniformity and adherence can be formed on the surface of the insulating layer without the need to roughen the surface by an oxidizer, such as an alkaline potassium permanganate solution. Therefore, the etching for circuit formation can be performed under milder conditions, so that excellent effects can be exerted in the realization of micro wiring on circuit board, such as a multilayer printed wiring board or a flexible printed wiring board.</p> |
