ELECTRONIC COMPONENTS EMBEDDED PCB AND THE METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: An electronic device-embedded printed circuit board and a manufacturing method thereof are provided to simplify a process without a process for forming an additional insulation layer by directly laminating a resin layer on a core layer. CONSTITUTION: An electronic device(20) is embedded in a core layer(30). A resin layer(13) is formed in the core layer. The core layer includes prepreg. An inner layer circuit(50) is formed on the resin layer by an SAP(Semi-Additive Process) or an MSAP(Modified Semi-Additive Process). The inner layer circuit is electrically connected to the electronic device. An insulation layer(60) is formed on the inner layer circuit. An outer layer circuit(70) is formed on the insulation layer. The outer layer circuit is connected to the inner layer circuit.