| 摘要 |
<P>PROBLEM TO BE SOLVED: To more precisely perform alignment even in an indirect alignment step. <P>SOLUTION: An alignment device uses a pattern formed prior to a preceding a step of aligning the pattern of a current step in the exposure step of the pattern. The alignment device has a correction calculation section 11 and a correction control section 13. The correction calculation section 11 calculates a correction value of a current lot for each of translation shift of the pattern in a wafer, magnification deviation, and rotational displacement in the current step based on the correction value of the current step of a preceding lot, the result of the current step of the preceding lot, the result of the preceding step in the preceding lot, and the result of the preceding step in the current lot. The correction control section 13 uses the correction value to control the translation shift of the pattern in the chip, the magnification deviation, and the rotational displacement. <P>COPYRIGHT: (C)2010,JPO&INPIT |
