| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding device which can hold objects to be held by laminating them in a favorable state in the accuracy of flatness, in the holding device in which a plurality of the objects to be held are held. Ž<P>SOLUTION: A substrate 60 as a first object to be held is mounted on a Y table 12 which is located on the uppermost position of a stage 1 and has an opening K3. A chip 62 as a second object to be held is held on a head 2 which is located above each opening K1-K3 of a supporting bed 8 of the stage 1, a X table 10, and a Y table 12. Then, a head 2 being lowered, a backup portion 3 located below each opening L1-K3 of the stage 1 is elevated so as to make the substrate 60 and the chip 62 abut on each other to pinch them locally and heat to join the substrate 60 with the chip 62. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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