| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sensor improved in measuring accuracy by reducing a temperature drift caused due to a difference in thermal expansion coefficient between constituting members. SOLUTION: The semiconductor sensor 1A(1) comprises at least a semiconductor substrate 2, a pressure sensing part 3 disposed on the semiconductor substrate, and a pad part 4 disposed adjacently to the pressure sensing part and electrically connected to the outside. The semiconductor substrate includes a groove 6 disposed between the pressure sensing part and the pad part on the surface provided with the pad part. COPYRIGHT: (C)2010,JPO&INPIT
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