| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve molding resistance of a surface-mounted surface acoustic wave device used mainly for mobile communication equipment. Ž<P>SOLUTION: The surface acoustic wave device includes an interdigital electrode 2 and a pad electrode 3 provided on a surface of a piezoelectric substrate 1, a side wall 7 enclosing the interdigital electrode 2 provided on the piezoelectric substrate 1, and a top plate provided on the side wall 7 to cover an excitation space 6 of the interdigital electrode 2. The top plate 8 is composed of a metal foil 8a covering an opening of the side wall 7 and a plating layer 8b provided on the metal foil, and the plating layer 8b is provided over the entire top surface of the metal foil 8a, the entire side surface, and the entire outer peripheral end of the reverse surface. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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