| 摘要 |
The present invention relates to an epoxy resin composition for semiconductor encapsulation, the epoxy resin composition including the following ingredients (A) to (C) and further including the following ingredient (D) as a flame retardant: (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; and (D) an aluminum hydroxide powder having a 50% volume cumulative diameter D50 (mum) of 1.5 to 5 mum and a BET specific surface area S (m2/g) of 3.3/D50<=S<=4.2/D50, and having a ratio D50/D10 of 1.5 to 4 wherein D10 is a 10% volume cumulative diameter thereof.
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