| 摘要 |
<p>The thermally conductive resin composition comprises (a) a matrix component, (b) a large-diameter thermally conductive inorganic powder, (c) a small-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or a curing agent. The above small-diameter thermally conductive inorganic powder is treated selectively with a silane compound represented by R(CH3)aSi(OR')3-a (R is a 6- to 20-carbon unsubstituted or substituted organic group, R' is a 1- to 4-carbon alkyl group and a is 0 or 1) or partial hydrolysate thereof. It is surface-treated with an amount that is less than the amount necessary to cover the entire surface area of the small-diameter thermally conductive inorganic powder. Provided thereby is a thermally conductive resin composition with low hardness, high thermal conductivity, low outgassing from the surface treatment agent, and storage stability, even when filled with a large amount of thermally conductive inorganic powder with respect to the resin component.</p> |
