| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element, wherein light emitted from the light emitting element can be reflected with a high reflectivity by a light reflecting layer comprising a conductor formed on bottom and side faces of a cavity wherein the light emitting element is mounted. <P>SOLUTION: A wiring board 1a for mounting a light emitting element includes: a substrate body 2a which has a plurality of ceramic layers (insulators) s1 to s6 laminated and has a front surface 3 and a rear surface 4; a cavity 5a which is opened to the front surface 3 of the substrate body 2a and comprises a bottom face 6 and a side face 7, in which a light emitting diode (light emitting element) D is mounted; a pad (light reflecting layer) 10 for mounting the light emitting element, an electrode (light reflecting layer) 11 pairing with the pad, and a light reflecting layer 9a which are formed on the bottom face 6 and the side face 7 of the cavity 5a. These light reflecting layers 9a, 9b, 10, and 11 have surface roughness Ra of ≤0.5 μm and an average peak interval S of ≥30 μm. <P>COPYRIGHT: (C)2010,JPO&INPIT |
