| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet, which has superior filling properties of irregularities caused by interconnect, wire or the like and satisfies thermal resistance and humidity-proofing, and to provide an one-piece sheet, a semiconductor device, and to provide a method of manufacturing the semiconductor device. <P>SOLUTION: The adhesive sheet is 10-100μm in thickness used for bonding and laminating a semiconductor chip A1 onto a board 3 having irregularities or wiring 4 of hollow wire 2 or onto a semiconductor chip with speed of 0.01-200 mm/s and load of 0.001-1 MPa. At expansion viscosity measurement at 80°C before curing, an SH value, which shows skewness hardenability, is≥-0.2 and≤0.8. In the adhesive sheet, A/C is≥8 and≤100, where A is an SH value, which shows skewness hardenability at 60°C, and B is an SH value which shows skewness hardenability at 80°C, and C=B if B is≥0.1, and C=0.1 if B is less than 0.1. The adhesive sheet has composition containing a thermosetting constituent and a high molecular constituent, where the sum of them is 40-85 vol.%, and filler of 15-60 vol.%. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
