| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an alignment method of chips, for certainly performing multi-die alignment. <P>SOLUTION: An alignment mark of a predetermined alignment chip in a predetermined alignment region on a semiconductor wafer is illuminated with light, for detecting a position based on reflection waveform, and alignment is collectively performed for a plurality of chips in the predetermined alignment region. The chip alignment method includes a step in which, if the reflection waveform is not detected, an alignment mark of an alternative chip different from the alignment chip in the alignment region is illuminated with light, for detecting its reflection waveform, to detect position of the alignment mark of the alternative chip, and a step in which, based on positions of the alignment marks of the alignment chip and the alternative chip, alignment is made for the plurality of chips in the alignment region. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
