METHOD FOR MANUFACTURING OF WIRING STRUCTURE, DISPLAY APPARATUS, AND METHOD FOR MANUFACTURING THEREOF

摘要

<P>PROBLEM TO BE SOLVED: To simultaneously form a wiring part 26 and a contact part 25, with no use of a CMP method. Ž<P>SOLUTION: A second film 24 is formed in predetermined thickness along the surface of an interlayer insulating film 23 where a contact hole 27 and a wiring groove 28 are formed. Thus, a hole 31 is formed by the second film 24 in the contact hole 27 while a groove 32 is formed by the second film 24 in the wiring groove 28. After a resist is formed on the second film 24 so as to close the opening end of the hole 31 and the groove 32, such second film 24 as exposed around the hole 31 and the groove 32 by etching back is removed by etching, and a contact part 25 is formed in the contact hole 27 while a wiring part 26 is formed in the wiring groove 28. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž