| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection structure capable of improving signal quality of communication between substrates. <P>SOLUTION: A first substrate 12 is inserted in the first insertion opening 13 of a connector 11, and a second substrate 14 is inserted in the second insertion opening 15. Under this condition, the first patterns 21, 22 of the first substrate 12 are connected to first connection pins 17, 18 formed on the inner wall of the first insertion opening 13 of the connector 11, and the second patterns 23, 24 of the second substrate 14 are connected to the second connection pins 19, 20 formed on the inner wall of the insertion opening 15 of the connector 11. A transmission route from the first connection pins 17, 18 till the second connection pins 19, 20 is a characteristic-impedance matched coplanar line. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
