POLYIMIDE FILM, METHOD FOR PRODUCTION THEREOF, POLYIMIDE-METAL LAMINATED PRODUCT, AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film having excellent adhesive properties, sputtering property, metal vapor deposition property, and metal plating property, and excellent surface smoothness while maintaining the excellent properties of an aromatic polyimide film.

SOLUTION: A method for producing the polyimide film comprises the steps of: applying a solution containing an aluminum chelate compound, a nonionic surfactant and/or aluminum alcoholate to one side or both sides of a self-supporting film of a polyimide precursor solution; and heating the solution-applied self-supporting film to effect imidization.

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