A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER AND METHODS OF FORMING THEREOF
摘要
A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed.
申请公布号
WO2009064345(A3)
申请公布日期
2009.11.12
申请号
WO2008US12115
申请日期
2008.10.23
申请人
SAINT-GOBAIN ABRASIVES, INC.;SAINT-GOBAIN ABRASIFS;WU, JIANHUI;HALL, RICHARD, W., J.