发明名称 WAFER LEVER LENS PORTION AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME
摘要 PURPOSE: A wafer lever lens portion and a light emitting device package using the same are provided to reduce package production time by making a processing of manufacturing the light emitting device package a batch process. CONSTITUTION: In a wafer lever lens portion and a light emitting device package using the same, a plurality of lens shapes(110) are arranged on a lens substrate(120). A shape reinforced pattern(130) is formed at a lower part of the lens substrate while supporting the lens substrate. The lens substrate and a reinforcement pattern are made of silicon, and the reinforcement pattern is a plurality of polygonal shapes or circulars. The lens unit and a package directly are contacted with each other, and the reinforcement pattern is a depressing or embossed carving.
申请公布号 KR20090116970(A) 申请公布日期 2009.11.12
申请号 KR20080042811 申请日期 2008.05.08
申请人 LG ELECTRONICS INC. 发明人 CHOI, MOON GOO;KIM, SANG CHEON
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项
地址