| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition which enables to form a pattern by irradiation with active energy rays, can form a protective film against etching, an interlayer dielectric and a surface protective film, and is excellent in sensitivity, resolution, pattern shape and alkali developability. <P>SOLUTION: The negative photosensitive resin composition comprises (A) an alkali-soluble phenolic resin, (B) a specific compound having a phenolic hydroxyl group, and (C) a photoacid generator. <P>COPYRIGHT: (C)2010,JPO&INPIT |
