| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of preventing a resin-based adhesive from being peeled from a first electrode pattern caused by a high-temperature environment such as heat during the reflow. <P>SOLUTION: In this semiconductor light-emitting device, in a first electrode pattern 2 covered by a sealing resin 7, there are provided a part 2a in which an adhesion treating layer 9 comprising a coupling agent is formed and a part 2b in which the adhesion treating layer 9 comprising the coupling agent is not formed, and on the part 2a in which the adhesion treating layer 9 comprising the coupling agent is formed, a semiconductor light-emitting element 5 is placed through a conductive adhesive 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
