| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package with high versatility, by solving the problem of the need for mounting two or more LED chips, high cost of design, and the need for circuit design for conventional both-side light-emitting chips. <P>SOLUTION: Lead frames 3, 4 and 5 are assembled in a body with its package body 1, and an LED element is mounted on the lead frames 3, 4 and 5, so it can be mounted on any circuit board. By constituting into such a structure, the need for packaging on the circuit board, as in conventional both-side light-emitting chip LEDs, is eliminated, and general-purposeness is enhanced. <P>COPYRIGHT: (C)2010,JPO&INPIT |
