发明名称 CONDUCTION STRUCTURE OF METAL CORE BOARD
摘要 PROBLEM TO BE SOLVED: To improve workability in conduction and fixing work and minimize a mounting area to ensure electrical connection between conductive patterns and a metal substrate. SOLUTION: The conduction structure of a metal core board includes the metal core board 1 having a conductive pattern 4 formed on a metal substrate 2 via an insulating layer 3, and a conductive member inserted in the metal core board 1 to electrically connect the conductive pattern 4 to the metal substrate 2. In the conduction structure, a plurality of layers of conductive patterns 4 and 6 insulated from each other are formed on the metal substrate 2, and the conductive member is a press-fit nut 12 press fitted in the metal core board 1. The press-fit nut 12 electrically connects the conductive patterns 4 and 6 to the metal substrate 2 serving as a ground. Press fitting the press-fit nut 12 in the metal core board 1, therefore, ensures electrical connection between the conductive patterns 4 and 6 and the metal substrate 2. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009267174(A) 申请公布日期 2009.11.12
申请号 JP20080116390 申请日期 2008.04.25
申请人 TDK-LAMBDA CORP 发明人 FUJISAKI DAISUKE;SATO KEI
分类号 H05K1/05 主分类号 H05K1/05
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