发明名称 |
DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER |
摘要 |
A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
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申请公布号 |
US2009279080(A1) |
申请公布日期 |
2009.11.12 |
申请号 |
US20090494858 |
申请日期 |
2009.06.30 |
申请人 |
VISTEC SEMICONDUCTOR SYSTEMS GMBH |
发明人 |
DANNER LAMBERT;HEIDEN MICHAEL;VOLLRATH WOLFGANG;BUTTNER ALEXANDER;KRAMPE-ZADLER CHRISTOF |
分类号 |
G01N21/88 |
主分类号 |
G01N21/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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