TRANSFER APPARATUS, METHOD FOR MANUFACTURING WAFER-LIKE OPTICAL DEVICE, ELECTRONIC ELEMENT WAFER MODULE, SENSOR WAFER MODULE, ELECTRONIC ELEMENT MODULE, SENSOR MODULE AND ELECTRONIC INFORMATION INSTRUMENT

摘要

PROBLEM TO BE SOLVED: To employ optical imprint technology using an opaque and metal-made stamper, and to mold both surfaces together with good productivity. SOLUTION: A light irradiation unit 12 for irradiating light to a transparent photo-curing resin material in-between from side faces of an upper stamper 1 and a lower stamper 2 is provided. In addition, rotary mechanisms 5 and 6 for rotating an upper holder 3 and a lower holder 4 together with the upper and lower stampers 1 and 2 at a constant speed when irradiating the light from the light irradiation unit 12 are provided. Further, the light irradiation unit 12 more uniformly irradiates the light to the inside of the transparent photo-curing material with irradiation illumination distributions of the unit 12 differed by making different a focal distance of a lens at the tip. COPYRIGHT: (C)2010,JPO&INPIT