| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a case structure of an electronic device capable of cooling, by an expensive configuration, a general electric component group and a high-heat generating electric component such as an amplifier mounted on a substrate by one fan. Ž<P>SOLUTION: An electric component group 103 excluding a high-heat generating electric component 103a is cooled by air sucked from the air inlet port 112 of a front panel 109 to flow on a wide air flow path between a substrate 104 and a plate-shaped member 2 at low speed, and then a heat discharge plate 4 is cooled by air made faster in flow by an air duct 5 to efficiently discharge heat from the high-heat generating electric component 103a. In other words, the electric component group 103 excluding the high-heat generating electric component 103a is cooled to make faster the flow of air whose temperature is slightly increased, and the high-heat generating electric component 103a is efficiently cooled by using this air again. Thereby, the electric component group 103 including the high-heat generating electric component 103a is cooled by one centrifugal flat fan 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
