| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device securing a wider imprinting area in the semiconductor device where a size of a package such as W-CSP is almost the same as a semiconductor chip. <P>SOLUTION: A semiconductor substrate is provided with: a plurality of through electrodes reaching a surface electrode from a backside thereof; a back wiring network which is formed at the backside of the semiconductor substrate and is connected to the through electrode; and an insulating film covering the back wiring network. The imprinting area having an imprinting mark is arranged at the backside of the semiconductor substrate. An outer edge of the imprinting area is spaced apart from the back wiring network in a face direction of an imprinting mark-forming face, and the area is arranged at a peripheral edge part of the semiconductor substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
