| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure capable of letting out a flux in a specified direction at the reflow in a component mounting to a board to prevent the immersing of the flux to the part without an adhesion of flux allowed. Ž<P>SOLUTION: The printed-wiring board 10 has a component mounting surface with mounting terminals 11, and connects the components by reflow-solder-processing in mounting the component 20. A concave part 13 is provided at the part of the component mounting surface with the component mounted so as to form a narrow space between the component mounting surface 22 and the bottom of the component. The concave part of the printed-wiring board forms a flux guidepath between it and the component 20 so as to guide the fused flux 31 from the inside of the void to the outside by the capillary phenomenon. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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