| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing moisture permeability to an area between a semiconductor substrate and a protecting member, suppressing dew condensation of the protecting member, and suppressing the separation of the semiconductor substrate and the protecting member, and to provide a method of manufacturing the semiconductor device. Ž<P>SOLUTION: The semiconductor device includes: a semiconductor substrate 11 having an element formation surface where a sensor element 18 is formed; an adhesive sheet 12, where a first adhesive layer 12a made of a material other than metal, a metal layer 12b, and a second adhesive layer 12c made of a material other than metal are laminated successively for sticking at an outer-periphery edge of the element formation surface; and a light transmissive protecting member 13 provided on the element formation surface via an adhesive sheet 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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