| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method which does not use any precious metal catalyst, accepts the loose limit of combination of an electroless plating system with metal for deposition, and allows the metal to be deposited by the electroless plating on a base metal without using any precious metal catalyst such as palladium and silver. SOLUTION: In the electroless plating method on a conductor 2 and an activation preprocessing method, a nuclide 3 is dispersed in an electroless plating solution, and the nuclide 3 on the surface of which a conductive layer 1 is being deposited by the electroless plating is brought into contact with the conductor 2. Further, in the electroless plating method on the conductor 2 and the activation preprocessing method, the nuclide 3 is dispersed in the electroless plating solution, the nuclide 3 on the surface of which the conductive layer 1 is being deposited by the electroless plating is dispersed, and the conductor 2 is immersed in the stirred plating solution. COPYRIGHT: (C)2010,JPO&INPIT
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