| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor wherein disconnection or contact failure is hardly caused in a wire material or the like provided in a movable part even if the movable part is repeatedly operated. Ž<P>SOLUTION: The apparatus for manufacturing the semiconductor includes a fixed part and a movable part which is movable to the fixed part. The movable part and/or the fixed part includes a transmission unit for transmitting a wireless signal, and the fixed part and/or the movable part includes a reception unit for receiving the wireless signal. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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