METHOD FOR PLATING RF EQUIPMENT AND RF EQUIPMENT MANUFACTURED THEREFROM

摘要

A method for plating RF equipment is disclosed. The disclosed method comprises (a) pretreating the RF equipment including components to be plated; (b) forming a copper-plated layer by performing copper plating of the RF equipment; and (c) forming a thin film layer made of noble metals on the copper-plated layer, wherein the thin film layer made of noble metals is thinner than the skin depth of a usable frequency band. Since the plating treatment is carried out at low costs, the method ensures good appearance and high quality.