发明名称 MOUNTING STRUCTURE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ONTO CIRCUIT BOARD
摘要 An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
申请公布号 US2009277684(A1) 申请公布日期 2009.11.12
申请号 US20060158904 申请日期 2006.12.19
申请人 TEIKOKU TSUSHIN KOGYO CO., LTD. 发明人 TAKAHASHI SHIGEMASA;YAMADA TAKASHI;MIZUNO SHINJI;KITAHARA MASAHIRO;MAKINO DAISUKE
分类号 H05K5/00;B29C45/14 主分类号 H05K5/00
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