发明名称 |
MOUNTING STRUCTURE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ONTO CIRCUIT BOARD |
摘要 |
An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other. |
申请公布号 |
US2009277684(A1) |
申请公布日期 |
2009.11.12 |
申请号 |
US20060158904 |
申请日期 |
2006.12.19 |
申请人 |
TEIKOKU TSUSHIN KOGYO CO., LTD. |
发明人 |
TAKAHASHI SHIGEMASA;YAMADA TAKASHI;MIZUNO SHINJI;KITAHARA MASAHIRO;MAKINO DAISUKE |
分类号 |
H05K5/00;B29C45/14 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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