| 摘要 |
A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing. |
