发明名称 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>Provided is a flex-rigid wiring board wherein a resin weak to chemicals is surely protected without increasing man-hour during a manufacturing step.  A method for manufacturing such flex-rigid wiring board is also provided.  The flex-rigid wiring board is composed of a flexible section (A) having a base film (24), i.e., an insulating layer, and a copper foil (26), i.e., a conductor layer; and a rigid section (B), which is integrally arranged with the flexible section (A) and has circuit patterns (28, 29).  One surface of the base film (24) of the flexible section (A) is entirely covered with the copper foil (26).  The copper foil (26) is removed when etching is performed in an intermediate processing step.  At the boundary between the flexible section (A) and the rigid section (B), a part extending from the removed copper foil (26) is embedded in the rigid section (B).</p>
申请公布号 WO2009136603(A1) 申请公布日期 2009.11.12
申请号 WO2009JP58565 申请日期 2009.05.01
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;URATSUJI ATSUHIRO 发明人 URATSUJI ATSUHIRO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利