| 发明名称 |
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
| 摘要 |
Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer. |
| 申请公布号 |
US2016247624(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615049639 |
申请日期 |
2016.02.22 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
SEO Youn-Soo;KANG Myung-Sam;KIM Jin-Soo;KO Young-Gwan;CHOI Woon-Chul;KIM In-Seok;CHA Hye-Yeon |
| 分类号 |
H01F27/255;H01F41/12;H01F41/02;H01F27/32;H01F27/28 |
主分类号 |
H01F27/255 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip electronic component, comprising:
a magnetic body including a magnetic material; a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor; an insulating layer covering the first coil conductor and the second coil conductor; and a magnetic layer formed on the insulating layer. |
| 地址 |
Suwon-Si KR |
