发明名称 ELECTRIC CONDUCTION PIN, METHOD OF MANUFACTURING THE ELECTRIC CONDUCTION PIN
摘要 PURPOSE: An electric conduction pin and a manufacturing method thereof are provided to remove an organic material remaining in the electric conduction pin in a cleaning process by separating an electric conduction pin structure array when the only ring connected to the electric conduction pin structure array is bonded in a sacrificial substrate. CONSTITUTION: An outer ring part(11) and an inner ring part(15) are formed by connecting to an electric conduction pin structure array(50). A horizontal array bridge(25) and a vertical array bridge(28) are formed in the electric conduction pin array unit. The electric conduction pin structure array is separated from a silicon substrate when the only outer ring is attached to the silicon substrate. A main bonding groove and a connection groove are formed in the electric conduction pin connection unit. A lower connection protrusion is formed in the lower electric conduction pin connection part.
申请公布号 KR20090117234(A) 申请公布日期 2009.11.12
申请号 KR20080043182 申请日期 2008.05.09
申请人 SONG, KWANG SUK;MIT CO., LTD. 发明人 SONG, KWANG SUK;SONG, KEYOUNG KU;JEONG, HAK SEOP;HAN, CHANG SEOK
分类号 H01L21/66 主分类号 H01L21/66
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