Method of lower profile MEMS package with stress isolations

摘要

MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.

主权项

1. A module comprising:
a module substrate; a surface mount substrate bonded to a top side the module substrate with an arrangement of conductive bumps including all conductive bumps bonding the surface mount substrate to the module substrate; wherein the arrangement of conductive bumps corresponds to an anchored area of the surface mount substrate directly over the module substrate, and the surface mount substrate includes a hanging area that laterally extends from the anchored area in which a conductive bump is not formed directly beneath the hanging area of the surface mount substrate; an integrated circuit (IC) die mounted on a front side of the surface mount substrate in the anchored area of the surface mount substrate; a micro-electro-mechanical systems (MEMS) die mounted on the front side of the surface mount substrate in the hanging area of the surface mount substrate; a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate.