发明名称 PROBE CARD HAVING REDISTRIBUTED WIRING PROBE NEEDLE STRUCTURE AND PROBE CARD MODULE USING THE SAME
摘要 PURPOSE: A probe card with a rewiring probe structure and a probe card module using the same are provided to test a silicon wafer according to the temperature history. CONSTITUTION: A probe card(40) with a rewiring probe structure includes a wafer(24,30) for the probe card, a penetration via electrode, and a rewiring probe structure. A plurality of penetration via electrodes(26a,32) pass through the wafer for the probe card. A rewiring probe structure(26b) of the twisted cage type is connected to the penetration via electrodes and is protruded from the one side of the wafer for the probe card.
申请公布号 KR20090117097(A) 申请公布日期 2009.11.12
申请号 KR20080042997 申请日期 2008.05.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JO, CHA JEA;CHUNG, TAE GYEONG;KIM, HOON JUNG;KIM, NAM SEOG;JEON, CHANG SEONG
分类号 H01L21/66 主分类号 H01L21/66
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