发明名称 |
PROBE CARD HAVING REDISTRIBUTED WIRING PROBE NEEDLE STRUCTURE AND PROBE CARD MODULE USING THE SAME |
摘要 |
PURPOSE: A probe card with a rewiring probe structure and a probe card module using the same are provided to test a silicon wafer according to the temperature history. CONSTITUTION: A probe card(40) with a rewiring probe structure includes a wafer(24,30) for the probe card, a penetration via electrode, and a rewiring probe structure. A plurality of penetration via electrodes(26a,32) pass through the wafer for the probe card. A rewiring probe structure(26b) of the twisted cage type is connected to the penetration via electrodes and is protruded from the one side of the wafer for the probe card. |
申请公布号 |
KR20090117097(A) |
申请公布日期 |
2009.11.12 |
申请号 |
KR20080042997 |
申请日期 |
2008.05.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JO, CHA JEA;CHUNG, TAE GYEONG;KIM, HOON JUNG;KIM, NAM SEOG;JEON, CHANG SEONG |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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