SEMICONDUCTOR PLASTIC PACKAGE AND FABRICATING METHOD THEREFORE

摘要

PURPOSE: A semiconductor plastic package and a fabricating method therefore are provided to excellent connection reliability since bending and twist between substrates contacting with a semiconductor chip. CONSTITUTION: In a semiconductor plastic package and a fabricating method therefore, a release sheet(140) is laminated on an area for mounting a semiconductor chip in a core substrate(110). A build-up insulating layer(130) is laminated on the core substrate. An opening is formed on a build up insulating layer by removing the build up insulating layer corresponding to a mold-release sheet so that they are separated from each other. A semiconductor chip is built in the opening and is connected with the core substrate through a flip chip type. A coefficient of thermal expansion of the core substrate is -10 or 9 ppm /°C. The core substrate is made of one of a glass fiber or a metal material.