| 摘要 |
PURPOSE: A method of manufacturing a device are provided to project a lager light along a division groove of an adhesive film by adding a protective tape on the surface of wafer which is divided individually. CONSTITUTION: In a method of manufacturing a device, a divided groove(210) having a depth corresponding to a finished thickness of a device cut along a street by a cutting blade is formed. A protection tape(4) is adhered to the surface of the wafer in which the divided groove is formed. A wafer is divided into an individual device. The adhesive film(6) is mounted on the back side of the wafer divided into the individual device. The adhesive film is divided along the divided groove by projecting the laser beam along the divided groove from the adhesive film. The protection tape adhered to the surface of the wafer is stripped from it.
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