| 摘要 |
PURPOSE: A high ductility Au surface treatment plating method of a flexible printed circuit board is provided to improve corrosion resistance by sealing a pinhole in an electroless Au plating process. CONSTITUTION: A flexible printed circuit board is degreased, is pickled, and is polished(S110). An electroless Ni plating layer is formed by coating an electroless Ni plating solution to a soldering part and a wire bonding part of the flexible printed circuit board(S120). An Au plating layer is formed on the electroless Ni plating layer(S130). A sealing agent is coated on the Au plating layer(S140). The sealing agent includes phosphate surfactant 1~3wt%, cyclic polyamine compound 1~4wt%, and water 93~98wt%.
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