| 摘要 |
Combined contacting is intended for power semiconductor module (10) and circuit board (100) with insulating substrate and conductive tracks (120) on it. Module contains plastics housing with substrate (50) with conductive track(s) (52) and semiconductor component(s) (56) on it. Substrate carries screw power terminal (40,80) and pressure actuated auxiliary terminals (60), e.g. gate, auxiliary emitter and/or sensor terminals. Further details of structuring, connection and interaction are specified. |
