Laser processing machine comprising a nozzle polishing device

摘要

A device (600) is provided to remove sputtered materials adhering to a nozzle (65) in a laser processing machine. In a laser processing, some sputtered material (S 1 ) adhering to a nozzle (65) degrades copy operations in the processing. A nozzle polishing device (600) comprises a processing head (610), and drives a processing tool (620) which may be a formed grindstone. The processing tool (620) of the formed grindstone has a processing surface (622) which is brought into contact with the nozzle (65) to remove the sputtered material (S 1 ).